Assembly and molding processes for three-dimensional microfabrication [electronic resource] / Elliot En-Yu Hui

Hui, Elliot En-Yu
Bib ID
vtls000605114
稽核項
123 p.
電子版
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數位化論文典藏聯盟
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$a Assembly and molding processes for three-dimensional microfabrication $h [electronic resource] / $c Elliot En-Yu Hui
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$a Source: Dissertation Abstracts International, Volume: 64-02, Section: B, page: 0873.
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$a Chair:  Roger T. Howe.
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$a Thesis (Ph.D.)--University of California, Berkeley, 2002.
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$a Lithographic semiconductor microfabrication has been employed with great success for the manufacture of mechanical structures, achieving microscopic dimensions and great complexity at low cost. However, due to the inherently planar nature of the lithographic process, this technology is limited in its capability to produce three-dimensional structures. In this work, three strategies are presented for extending thin-film microfabrication into the third dimension.
520
$a First, the pop-up mechanisms of children's storybooks are utilized on the micro scale to assemble three-dimensional microstructures out of planar parts. Particular attention is given to hinge design in the four-level SUMMiT surface micromachining foundry process. The use of pop-up mechanisms enables more efficient assembly of fold-up MEMS structures and also creates the potential for the parallel assembly of complex three-dimensional microstructures.
520
$a Next, a conformal carbon film is produced for use as a release layer in the molding of polysilicon structures. Parylene C polymer is deposited from the vapor phase as a conformal film and then carbonized at 825&deg;C in N<sub>2</sub>. Pretreatment in a CHF<sub>3</sub> and He plasma in addition to a pre-curing step at 490&deg;C are employed to minimize distortion in the carbonization process, during which a one-eighth reduction in thickness occurs. The extremely thin (0.3 &mu;m) and conformal carbon layer yields sub-micron precision in molding. Further, the release process is dry, rapid and extremely selective, allowing large structures to be released without damage. Release is accomplished by oxidizing at 825&deg;C in dry O<sub>2</sub> gas, achieving a burnout rate of 50 &mu;m/min for the first 2 mm of undercut.
520
$a Finally, parylene structural films are molded and subsequently released without the need for a sacrificial layer or release etch. Application of Micro-90 detergent solution to the mold prior to parylene deposition prevents adhesion. A number of strategies are explored for the aligned bonding of these parylene layers, with thermal-compression showing the most promise. One possible application is a bistable fluid valve for use in an ocular implant for glaucoma therapy. Molded fluid channels and a bistable valve element are demonstrated.
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$a 數位化論文典藏聯盟 $b PQDT $c 淡江大學(2004)
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$a Electrical engineering.
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$a Mechanical engineering.
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$a Ophthalmology
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$a University of California, Berkeley.
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摘要
Lithographic semiconductor microfabrication has been employed with great success for the manufacture of mechanical structures, achieving microscopic dimensions and great complexity at low cost. However, due to the inherently planar nature of the lithographic process, this technology is limited in its capability to produce three-dimensional structures. In this work, three strategies are presented for extending thin-film microfabrication into the third dimension.
First, the pop-up mechanisms of children's storybooks are utilized on the micro scale to assemble three-dimensional microstructures out of planar parts. Particular attention is given to hinge design in the four-level SUMMiT surface micromachining foundry process. The use of pop-up mechanisms enables more efficient assembly of fold-up MEMS structures and also creates the potential for the parallel assembly of complex three-dimensional microstructures.
Next, a conformal carbon film is produced for use as a release layer in the molding of polysilicon structures. Parylene C polymer is deposited from the vapor phase as a conformal film and then carbonized at 825&deg;C in N<sub>2</sub>. Pretreatment in a CHF<sub>3</sub> and He plasma in addition to a pre-curing step at 490&deg;C are employed to minimize distortion in the carbonization process, during which a one-eighth reduction in thickness occurs. The extremely thin (0.3 &mu;m) and conformal carbon layer yields sub-micron precision in molding. Further, the release process is dry, rapid and extremely selective, allowing large structures to be released without damage. Release is accomplished by oxidizing at 825&deg;C in dry O<sub>2</sub> gas, achieving a burnout rate of 50 &mu;m/min for the first 2 mm of undercut.
Finally, parylene structural films are molded and subsequently released without the need for a sacrificial layer or release etch. Application of Micro-90 detergent solution to the mold prior to parylene deposition prevents adhesion. A number of strategies are explored for the aligned bonding of these parylene layers, with thermal-compression showing the most promise. One possible application is a bistable fluid valve for use in an ocular implant for glaucoma therapy. Molded fluid channels and a bistable valve element are demonstrated.
附註
Source: Dissertation Abstracts International, Volume: 64-02, Section: B, page: 0873.
Chair: Roger T. Howe.
Thesis (Ph.D.)--University of California, Berkeley, 2002.
數位化論文典藏聯盟
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